16 – 18 February 2017
University of Coimbra, Portugal
Health Sciences Campus
The IEEE 5th Portuguese Meeting on Bioengineering (ENBENG) organized by the Portuguese Chapter of IEEE Engineering in Medicine & Biology Society (EMBS), will be hosted at the Health Sciences Campus of the University of Coimbra between the 16th and the 18th of February of 2017.
The conference will cover diverse topics from biomedical and healthcare technology research and development to clinical applications and biomedical education. The conference program will feature keynote lectures, invited sessions, oral and poster sessions and sessions for students and young professionals.
All are encouraged to submit papers to be considered for presentation at the ENBENG 2017.
Prof. Miguel Castelo Branco
(Faculty of Medicine, UC)
Prof. Urbano Nunes
(Faculty of Sciences and Technology, UC)
Invited talks will present their overview on current topics and trends on the fields of Bioengineering.
Meet the Portuguese community on Bioengineering, working in different fields, and foster new collaborations and sharing.
Share your work with your peers, get feedback and publish in the Conference Proceedings published by IEEE.
Conference themes include, but are not limited to:
Biomedical Imaging and Image Processing
Biomedical Signal Processing
Stem Cell Biology and Regenerative Medicine
Biomolecular and Bioprocess
Biomaterials, Micro- and Nano-bioengineering, Cellular and Tissue Engineering
Medical and Bio-Robotics, Surgical Planning and Biomechanics
Therapeutic and Diagnostic Systems, Devices and Technologies, Clinical Engineering
Neural Engineering, Neuromuscular Systems and Rehabilitation Engineering
Cardiovascular & Respiratory Systems Engineering
Wearable Biomedical Sensors and Systems
Computational Systems and Synthetic Biology
Modeling of Physiological Systems, Multiscale Modeling
Biomedical and Health Informatics
Domicile Autonomy Assistance and Ambient Assisted Living
Biomedical Engineering Education and Society
Empowering Individual Healthcare Decisions Through Technology
PAPER SUBMISSIONS CLOSED